Invention Grant
- Patent Title: Multiple diameter wire connection
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Application No.: US16320165Application Date: 2017-08-06
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Publication No.: US10855042B2Publication Date: 2020-12-01
- Inventor: Dror Benatav
- Applicant: D.M. Benatav Ltd.
- Applicant Address: IL Petach Tikva
- Assignee: D.M. BENATAV LTD.
- Current Assignee: D.M. BENATAV LTD.
- Current Assignee Address: IL Petach Tikva
- Agent Chanoch Kahn; Simon Kahn
- International Application: PCT/IL2017/050863 WO 20170806
- International Announcement: WO2018/029674 WO 20180215
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H01R43/02 ; H01R4/02 ; H01R4/70 ; H01R4/62

Abstract:
A method of connecting a fine wire to an ultrafine wire, the fine wire exhibiting a first cross-section and the ultrafine wire exhibiting a second cross-section, the second cross-section smaller than the first cross-section, the method constituted of: providing an uninsulated portion of the fine wire exhibiting a flat surface; depositing a conductive material on the flat surface of the provided uninsulated portion of the fine wire; providing an uninsulated portion of the ultrafine wire; and bonding the provided uninsulated portion of the ultrafine wire to the deposited conductive material on the flat surface of the provided uninsulated portion of the fine wire by thermocompression.
Public/Granted literature
- US20190273353A1 Multiple Diameter Wire Connection Public/Granted day:2019-09-05
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