Invention Grant
- Patent Title: Semiconductor laser device and method for manufacturing semiconductor laser device
-
Application No.: US16462505Application Date: 2017-01-19
-
Publication No.: US10855054B2Publication Date: 2020-12-01
- Inventor: Ayumi Fuchida , Yuichiro Okunuki , Go Sakaino , Tetsuya Uetsuji , Naoki Nakamura
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2017/001769 WO 20170119
- International Announcement: WO2018/134950 WO 20180726
- Main IPC: H01S5/12
- IPC: H01S5/12 ; H01S5/10

Abstract:
A semiconductor laser device includes a semiconductor substrate, a resonator unit formed on the semiconductor substrate and having an active layer, a diffraction grating formed on or underneath the active layer, a front facet of an inverted mesa slope, and a rear facet, an anti-reflection coating film formed on the front facet, a reflective film formed on the rear facet, an upper electrode formed on the resonator unit, and a lower electrode formed underneath the semiconductor substrate, wherein a length in a resonator direction of the resonator unit is shorter than a length in the resonator direction of the semiconductor substrate, and a laser beam is emitted from the front facet.
Public/Granted literature
- US20190334317A1 SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LASER DEVICE Public/Granted day:2019-10-31
Information query