Invention Grant
- Patent Title: VCSEL array with common wafer level integrated optical device
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Application No.: US16796959Application Date: 2020-02-21
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Publication No.: US10855055B2Publication Date: 2020-12-01
- Inventor: Pascal Jean Henri Bloemen , Stephan Gronenborn
- Applicant: TRUMPF Photonic Components GmbH
- Applicant Address: DE Ulm
- Assignee: TRUMPF PHOTONIC COMPONENTS GMBH
- Current Assignee: TRUMPF PHOTONIC COMPONENTS GMBH
- Current Assignee Address: DE Ulm
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: EP17187428 20170823
- Main IPC: H01S5/18
- IPC: H01S5/18 ; H01S5/183 ; G01S7/481 ; H01S5/022 ; H01S5/026 ; H01S5/42

Abstract:
A VCSEL array has VCSELs on a semiconductor substrate and has a prismatic or Fresnel optical structure, which is arranged to transform laser light to provide a continuous illumination pattern in a reference plane. The optical structure increases a size of the illumination pattern in comparison to an untransformed illumination pattern. The optical structure is arranged such that each VCSEL illuminates a sector of the pattern. Sub-surfaces of the optical structure with different height above the semiconductor substrate are arranged next to each other. Each VCSEL is associated with a sub-surface. A distance between each VCSEL and a size of its sub-surface is arranged such that the VCSEL illuminates only a part of the sub-surface without illuminating one of the steps. The VCSEL array has an array of microlenses, each VCSEL being associated with a microlens arranged to collimate the laser light after traversing the optical structure.
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