Invention Grant
- Patent Title: Printed circuit board assembly
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Application No.: US16320815Application Date: 2017-06-26
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Publication No.: US10856419B2Publication Date: 2020-12-01
- Inventor: Josef Loibl
- Applicant: ZF Friedrichshafen AG
- Applicant Address: DE Friedrichshafen
- Assignee: ZF FRIEDRICHSHAFEN AG
- Current Assignee: ZF FRIEDRICHSHAFEN AG
- Current Assignee Address: DE Friedrichshafen
- Agency: Brinks Gilson & Lione
- Priority: DE102016213697 20160726
- International Application: PCT/EP2017/065685 WO 20170626
- International Announcement: WO2018/019500 WO 20180201
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K3/28 ; H05K1/18 ; H05K5/00 ; H05K3/46

Abstract:
A printed circuit board assembly (1) is provided that comprises a stacked or folded printed circuit board populated by components (2, 3), wherein printed circuit board regions (10, 11, 12) lying opposite one another are electrically connected to one another at least one edge, and wherein the printed circuit board and the components (2, 3) are encased in an encapsulation (4), and wherein at least one separating element (5) is located inside the encapsulation and between each pair of opposing and electrically connected printed circuit board regions (10, 11, 12).
Public/Granted literature
- US20190174628A1 PRINTED CIRCUIT BOARD ASSEMBLY Public/Granted day:2019-06-06
Information query