A cooling device includes a heat reception base configured to receive heat transmitted from an electronic component. The cooling device also include a fin base configured to face the heat reception base. The fin base is also configured to form a ventilation path through which air flows between the fin base and the heat reception base. A heat conductor coupled with the heat reception base and the fin base is also included. The cooling device also includes a plurality of radiation fins configured to extend from the fin base to a side opposite to the heat reception base. The fin base includes an air outlet configured to communicate with a gap between the radiation fins adjacent to each other.