Invention Grant
- Patent Title: Multilayer structures, multilayer films, and packages formed therefrom
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Application No.: US16321134Application Date: 2017-07-27
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Publication No.: US10857767B2Publication Date: 2020-12-08
- Inventor: João Gargalaka, Jr. , Nicolas Cardoso Mazzola , Rafaela De Foggi Carioli , Marcelo Delmar Cantu , Jorge Caminero Gomes
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- Agency: Brooks, Cameron & Huebsch, PLLC
- International Application: PCT/US2017/044097 WO 20170727
- International Announcement: WO2018/022839 WO 20180201
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B27/30 ; B32B27/32 ; B32B27/34 ; B32B7/06 ; B65D65/40

Abstract:
Embodiments relate to multilayer structures, multilayer films, and packages formed therefrom. As an example, a multilayer structure can include a multilayer structure comprising a polyolefin sealant layer, a coupling layer on the polyolefin sealant layer, where the coupling layer includes a polyolefin and a maleic anhydride grafted (MAH) polymer, where the total amount of MAH polymer is from 15 weight percent to 50 weight percent of a total weight percent of the coupling layer, where the polyolefin is selected from the group consisting of a high pressure low density polyethylene, a high density polyethylene, an ethylene acrylic acid copolymer, an ethylene(meth)acrylic acid copolymer, propylene based plastomers, ionomers or a combination thereof, and a barrier layer directly on the coupling layer.
Public/Granted literature
- US20190152205A1 MULTILAYER STRUCTURES, MULITLAYER FILMS, AND PACKAGES FORMED THEREFROM Public/Granted day:2019-05-23
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