The present invention relates to a pressure-sensitive adhesive tape comprising or consisting of a moisture-curing composition comprising or consisting of: A 5 to 60 parts by weight of at least one film-former component; B 40 to 95 parts by weight of at least one epoxide component; C 10 to 500 parts by weight of at least one moisture-activatable curing agent; D optionally 0.1 to 15 parts by weight of at least one stabilizer, and E optionally 0.1 to 200 parts by weight of at least one additive, based in each case on the moisture-curing composition, with the parts by weight of components A and B adding up to 100 and with the moisture-curing composition being characterized in that the moisture-activatable hardener C comprises or consists of at least one blocked amine. The invention further relates to a method for assembling two components using such adhesive tape.