Invention Grant
- Patent Title: Reducing thermal expansion induced errors in a magnetic circuit assembly
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Application No.: US16119573Application Date: 2018-08-31
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Publication No.: US10859593B2Publication Date: 2020-12-08
- Inventor: Paul W. Dwyer , John Strehlow
- Applicant: Honeywell International Inc.
- Applicant Address: US NC Charlotte
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NC Charlotte
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: G01P1/00
- IPC: G01P1/00 ; G01P15/125 ; G01P1/02 ; G01P15/08
Abstract:
A magnetic circuit assembly for an accelerometer includes an excitation ring that includes a base portion defining oppositely facing first and second sides, a ring portion extending from the second side of the base portion to define a ring recess, a first metallic inlay recessed into the first side of the base portion in which the first metallic inlay includes a material different than that of the base portion, a second metallic inlay recessed into the second side of the base portion in which the second metallic inlay includes a material different than that of the base portion, and a magnet received within the ring recess and attached to the second metallic inlay.
Public/Granted literature
- US20200072862A1 REDUCING THERMAL EXPANSION INDUCED ERRORS IN A MAGNETIC CIRCUIT ASSEMBLY Public/Granted day:2020-03-05
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