In various embodiments, a wearable component configured to be worn on a head of a user is disclosed. The wearable component can comprise a wearable support and an electronic component coupled to or disposed within the wearable support. A thermal management structure can be provided in thermal communication with the electronic component. The thermal management structure can be configured to transfer heat from the electronic component away from the head of the user when the wearable support is disposed on the head of the user.