Invention Grant
- Patent Title: Integrated circuits having in-situ constraints
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Application No.: US15903603Application Date: 2018-02-23
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Publication No.: US10860773B2Publication Date: 2020-12-08
- Inventor: Qi-De Qian
- Applicant: IYM Technologies LLC
- Applicant Address: US NY Suffern
- Assignee: IYM Technologies LLC
- Current Assignee: IYM Technologies LLC
- Current Assignee Address: US NY Suffern
- Agency: Hoffberg & Associates
- Agent Steven M. Hoffberg
- Main IPC: G06F30/00
- IPC: G06F30/00 ; G06F30/398 ; G03F1/70 ; G06F30/39 ; G06F30/392 ; G06F30/394 ; H01L27/02

Abstract:
In accordance with the present method and system for improving integrated circuit layout, a local process modification is calculated from simulated process response variables at a set of control points. Said modification values are incorporated into the layout constraints imposed by design rules and design intent to account for manufacturing friendliness. Solving the updated constraint equation with user specified objective function produces a new layout with increased manufacturability. The new layout may further contain data tags that enable optimal process correction to be performed on selected locations, leading to reduction in data size and mask complexity. Also in accordance with this invention, physical design tools are enhanced to read and process anisotropic design rules.
Public/Granted literature
- US20180181697A1 INTEGRATED CIRCUITS HAVING IN-SITU CONSTRAINTS Public/Granted day:2018-06-28
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