- Patent Title: Methods of manufacturing security documents and security devices
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Application No.: US15740172Application Date: 2016-07-11
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Publication No.: US10861121B2Publication Date: 2020-12-08
- Inventor: Brian William Holmes , John Godfrey , Ian Cornes , John O'Malley , Lawrence George Commander
- Applicant: DE LA RUE INTERNATIONAL LIMITED
- Applicant Address: GB Hampshire
- Assignee: DE LA RUE INTERNATIONAL LIMITED
- Current Assignee: DE LA RUE INTERNATIONAL LIMITED
- Current Assignee Address: GB Hampshire
- Agency: Oliff PLC
- Priority: GB1512118.9 20150710
- International Application: PCT/GB2016/052081 WO 20160711
- International Announcement: WO2017/009616 WO 20170119
- Main IPC: G06T1/00
- IPC: G06T1/00 ; B29D11/00 ; G02B3/00 ; B42D25/425 ; B42D25/45 ; B42D25/455 ; B42D25/324 ; B42D25/46 ; B42D25/355 ; B42D25/378 ; B42D25/48 ; B42D25/342 ; B42D25/351 ; B41M3/14 ; G02B1/04 ; G06T7/80 ; G06K9/32 ; H04N1/00 ; H04N5/232 ; H04N5/247 ; B42D25/29 ; B42D25/23 ; B42D25/24 ; B42D25/47

Abstract:
A method of manufacturing a security document, including: providing a polymer substrate having first and second surfaces; and: applying an array of focussing elements to the first surface of the polymer substrate across a first region; forming an image array by: providing a die form having a surface including an arrangement of raised areas and recessed areas defining the pattern; applying a first curable material to the surface of the die form so it substantially fills the recessed areas; bringing a pattern support layer in contact with the surface of the die form so it covers the recessed areas; separating the pattern support layer from the surface of the die form so the first curable material in the recessed areas is removed from the recessed areas and retained on the pattern support layer; and at least partly curing the first curable material in one or more curing steps.
Public/Granted literature
- US20180186166A1 METHODS OF MANUFACTURING SECURITY DOCUMENTS AND SECURITY DEVICES Public/Granted day:2018-07-05
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