Invention Grant
- Patent Title: Transfer printing substrate and method for producing the same
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Application No.: US15960901Application Date: 2018-04-24
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Publication No.: US10861356B2Publication Date: 2020-12-08
- Inventor: Xingda Xia , Junhui Lou , Zeshang He
- Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee: SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Current Assignee Address: CN Shanghai
- Agency: Tarolli, Sundheim, Covell & Tummino LLP
- Priority: CN201711105426 20171110
- Main IPC: H01L29/06
- IPC: H01L29/06 ; G09F9/33 ; B41C1/06 ; H01L23/00 ; H01L21/683 ; H01L33/00 ; B41F16/00

Abstract:
Provided is a transfer printing substrate and a method for producing the same, in order to improve yield of picking up of the micro-components and further improve quality of image display. The transfer printing substrate includes a carrying substrate, a plurality of supporting structures, and a plurality of micro-components corresponding to the plurality of support structures in one-to-one correspondence, wherein each of the plurality of supporting structures includes a fixing part and a suspended supporting part, wherein an end of the fixing part is fixed on the carrying substrate, an end of the suspended supporting part is connected to the fixing part, the other end of the suspended supporting part supports a corresponding one of the plurality of micro-components, and a first moving space is provided between the suspended supporting part and the carrying substrate. The transfer printing substrate is used for transferring the micro-components.
Public/Granted literature
- US20190147778A1 TRANSFER PRINTING SUBSTRATE AND METHOD FOR PRODUCING THE SAME Public/Granted day:2019-05-16
Information query
IPC分类: