Invention Grant
- Patent Title: Capacitor with volumetrically efficient hermetic packaging
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Application No.: US15090165Application Date: 2016-04-04
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Publication No.: US10861652B2Publication Date: 2020-12-08
- Inventor: Antony Chacko , Randolph S. Hahn , David Jacobs , Brandon Summey
- Applicant: KEMET Electronics Corporation
- Applicant Address: US FL Fort Lauderdale
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US FL Fort Lauderdale
- Agency: Patent Filing Specialist Inc.
- Agent Joseph T. Guy
- Main IPC: H01G9/10
- IPC: H01G9/10 ; H01G9/00 ; H01G9/15 ; H01G9/04 ; H01G9/042

Abstract:
An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.
Public/Granted literature
- US20160329156A1 Capacitor with Volumetrically Efficient Hermetic Packaging Public/Granted day:2016-11-10
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