Invention Grant
- Patent Title: Method of manufacturing an insulation layer on silicon carbide
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Application No.: US16478347Application Date: 2017-12-21
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Publication No.: US10861694B2Publication Date: 2020-12-08
- Inventor: Yuji Komatsu
- Applicant: ZF Friedrichshafen AG
- Applicant Address: DE Friedrichshafen
- Assignee: ZF FRIEDRICHSHAFEN AG
- Current Assignee: ZF FRIEDRICHSHAFEN AG
- Current Assignee Address: DE Friedrichshafen
- Agency: Dority & Manning, P.A.
- Priority: DE102017200615 20170117
- International Application: PCT/EP2017/083988 WO 20171221
- International Announcement: WO2018/134024 WO 20180726
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/02 ; H01L21/04 ; H01L29/00 ; H01L29/16

Abstract:
A method of manufacturing an insulation layer on silicon carbide includes first preparing a surface of the silicon carbide, then forming a first part of the insulation layer on the surface at a temperature lower than 400° Celsius. Finally, a second part of the insulation layer is formed by depositing a dielectric film on the first part. The surface of the silicon carbide is illuminated by a light at a wavelength below and/or equal to 450 nm during and/or after the formation of the first part of the insulation layer.
Public/Granted literature
- US20190371601A1 Method of Manufacturing an Insulation Layer on Silicon Carbide Public/Granted day:2019-12-05
Information query
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