Invention Grant
- Patent Title: Apparatus and method for processing wafer
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Application No.: US16265879Application Date: 2019-02-01
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Publication No.: US10861721B2Publication Date: 2020-12-08
- Inventor: You-Hua Chou , Min-Hao Hong , Kuan-Chung Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; G03B21/20 ; H01L33/08 ; H01R33/08
Abstract:
A method includes delivering a wafer into a process chamber, applying a thermal energy to the wafer by a heat source, and moving the heat source substantially along a longitudinal direction of the heat source with respect to the wafer. An apparatus that performs the method is also disclosed.
Public/Granted literature
- US20190172735A1 APPARATUS AND METHOD FOR PROCESSING WAFER Public/Granted day:2019-06-06
Information query
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