Invention Grant
- Patent Title: Electronic package for integrated circuits and related methods
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Application No.: US15823149Application Date: 2017-11-27
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Publication No.: US10861741B2Publication Date: 2020-12-08
- Inventor: Kurt Peter Wachtler , Anindya Poddar , Usman Mahmood Chaudhry
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Charles A. Brill; Frank D. Cimino
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H01L21/768 ; H01L23/498 ; H05K1/18 ; B81B7/00 ; H01L23/31 ; H01L21/822 ; H01L23/00 ; H01L23/04
Abstract:
Electronic packages and related methods are disclosed. An example electronic package apparatus includes a substrate and an electronic component. A protective material is positioned on a first surface, a second surface and all side surfaces of the electronic component to encase the electronic component. An enclosure is coupled to the substrate to cover the protective material and the electronic component.
Public/Granted literature
- US20190164807A1 ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS Public/Granted day:2019-05-30
Information query
