Invention Grant
- Patent Title: Package structure with multiple substrates
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Application No.: US15993169Application Date: 2018-05-30
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Publication No.: US10861767B2Publication Date: 2020-12-08
- Inventor: Atapol Prajuckamol , Chee Hiong Chew , Yushuang Yao
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Phoenix
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Phoenix
- Agency: Brake Hughes Bellermann LLP
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/055 ; H01L21/48 ; H01L23/538

Abstract:
Example implementations relate to an electronic module can include a first direct bonded metal (DBM) substrate, a second DBM substrate, a housing member, and a plurality of connection terminals. The first DBM substrate and second DBM substrate can be aligned along a same plane. The housing member can be coupled to the first substrate and the second substrate and the housing member can include a plurality of openings in a surface of the housing member. The plurality of connection terminals can be electrically coupled to at least one of the first DBM substrate and the second DBM substrate, in which a connection terminal from the plurality of terminals can extend through an opening from the plurality of openings of the housing member.
Information query
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