Invention Grant
- Patent Title: Power module and semiconductor apparatus
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Application No.: US16132504Application Date: 2018-09-17
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Publication No.: US10861770B2Publication Date: 2020-12-08
- Inventor: Teruaki Nagahara
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2018-024101 20180214
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H05K7/14 ; H05K7/20 ; H01L23/28 ; H01L23/049
Abstract:
Examples of a power module include a resin housing including a main body and at least one projection protruding from the main body, and a lead terminal extending outwardly from the main body, wherein a through-hole is provided so as to penetrate the main body and the projection protruding from the main body.
Public/Granted literature
- US20190252292A1 POWER MODULE AND SEMICONDUCTOR APPARATUS Public/Granted day:2019-08-15
Information query
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