A semiconductor package device includes a substrate, an insulation layer disposed on the substrate, and a shielding layer. The shielding layer includes an adhesive layer and a base layer. The adhesive layer is disposed between the base layer and the insulation layer. The adhesive layer and the base layer include a filler including at least a resin. The shielding layer passes a peeling test class of at least 3B of a cross-cut method and the shielding effectiveness of the shielding layer is at least or equal to 30 dB.