An electronic apparatus includes first and second packages. The first package includes a first semiconductor chip between opposing first and second surfaces of the first package, a plurality of terminals on the first semiconductor chip facing a first direction that is perpendicular to the first and second surface, the terminals including first input/output terminals and a second input/output terminal, and a plurality of bumps that are electrically connected to the plurality of first input/output terminals at positions that are directly below the first semiconductor chip in the first direction. The second package includes a second semiconductor chip provided on the second surface of the first package, a wire that electrically connects the second semiconductor chip to a conductor that is electrically connected to the second input/output terminal, and coating resin that covers the second surface of the first package, the second semiconductor chip and the wire.