Invention Grant
- Patent Title: Semiconductor device and protection element
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Application No.: US16462366Application Date: 2017-11-30
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Publication No.: US10861847B2Publication Date: 2020-12-08
- Inventor: Masaaki Bairo
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Chip Law Group
- Priority: JP2016-242146 20161214
- International Application: PCT/JP2017/043160 WO 20171130
- International Announcement: WO2018/110304 WO 20180621
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L27/12

Abstract:
Provided is a semiconductor device and a protection element capable of suppressing electrical damage to a MOSFET or the like in a semiconductor substrate. A semiconductor device according to a first aspect of the present technology includes a MOSFET as a protected element formed on a semiconductor substrate and a protection element that suppresses electrical damage to the protected element formed on the semiconductor substrate, in which the protection element includes the semiconductor substrate, one or more layers of well regions formed on the semiconductor substrate, and a diffusion layer formed on the well region. The present technology can be applied to a CMOS image sensor, for example.
Public/Granted literature
- US20190341380A1 SEMICONDUCTOR DEVICE AND PROTECTION ELEMENT Public/Granted day:2019-11-07
Information query
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