An electronic device has a multilayer structure including a plurality of wires in multiple layers, and a conductive material on a surface of the multilayer structure for electrically connecting two or more wires included in the plurality of wires. The surface of the multilayer structure has a first recess. The conductive material is in the first recess and on the surface of the multilayer structure. The conductive material has an upper surface. The upper surface has a second recess corresponding to the first recess. The second recess has a bottom surface at a higher position than an upper surface of the uppermost layer of the two or more wires.