Invention Grant
- Patent Title: Integrated circuits with capacitors
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Application No.: US16183113Application Date: 2018-11-07
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Publication No.: US10861928B2Publication Date: 2020-12-08
- Inventor: Hsiao-Han Liu , Hoppy Lee , Chung-Yu Chiang , Po-Nien Chen , Chih-Yung Lin
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L27/07 ; H01L21/8234 ; H01L29/66 ; H01L21/768 ; H01L21/033

Abstract:
Examples of an integrated circuit with a capacitor structure and a method for forming the integrated circuit are provided herein. In some examples, an integrated circuit device includes a substrate and a trench isolation material disposed on the substrate. An isolation structure is disposed on the trench isolation material. A first electrode disposed on the isolation structure, and a second electrode disposed on the isolation structure. A capacitor dielectric is disposed on the isolation structure between the first electrode and the second electrode. In some such examples, the isolation structure includes a first hard mask disposed on the trench isolation material, a dielectric disposed on the first hard mask, and a second hard mask disposed on the dielectric.
Public/Granted literature
- US20200091277A1 Integrated Circuits with Capacitors Public/Granted day:2020-03-19
Information query
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