Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US16515087Application Date: 2019-07-18
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Publication No.: US10861932B2Publication Date: 2020-12-08
- Inventor: Ze Chen , Kazuhiro Shimizu
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2018-198825 20181023
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/761 ; H01L29/66 ; H01L29/739

Abstract:
A semiconductor device includes a well region, a buffer region, an insulating film, an electrode, and an electric field relaxing structure. An impurity concentration in the buffer region is reduced in a direction away from the active region. An end portion of the electrode is located at a position closer to the active region than an end portion of the buffer region. The electric field relaxing structure includes a plurality of RESURF layers each surrounding the buffer region in a plan view and formed in a surface layer of the semiconductor substrate.
Public/Granted literature
- US20200127082A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2020-04-23
Information query
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