Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
-
Application No.: US16566997Application Date: 2019-09-11
-
Publication No.: US10861944B2Publication Date: 2020-12-08
- Inventor: Shigeya Kimura , Hisashi Yoshida , Tatsuo Shimizu , Ryosuke Iijima
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2019-018150 20190204
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/20 ; H01L29/16 ; H01L21/04 ; H01L21/285 ; H01L29/45

Abstract:
According to one embodiment, a semiconductor device includes a first layer, a first electrode, and a first nitride region. The first layer includes a first material and a first partial region. The first material includes at least one selected from the group consisting of silicon carbide, silicon, carbon, and germanium. The first partial region is of a first conductivity type. The first conductivity type is one of an n-type or a p-type. A direction from the first partial region toward the first electrode is aligned with a first direction. The first nitride region includes Alx1Ga1-x1N (0≤x1
Public/Granted literature
- US20200251562A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2020-08-06
Information query
IPC分类: