Invention Grant
- Patent Title: FinFET devices and methods of forming
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Application No.: US16230333Application Date: 2018-12-21
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Publication No.: US10861957B2Publication Date: 2020-12-08
- Inventor: Chia-Cheng Chen , Huicheng Chang , Liang-Yin Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L21/02 ; H01L29/10

Abstract:
A finFET device and methods of forming a finFET device are provided. The method includes forming a capping layer over a fin of a fin field effect transistor (finFET), where the fin is formed of a material comprising germanium. The method also includes forming a dummy dielectric layer over the capping layer. The method also includes forming a dummy gate over the dummy dielectric layer. The method also includes removing the dummy gate.
Public/Granted literature
- US20190123181A1 FinFET Devices and Methods of Forming Public/Granted day:2019-04-25
Information query
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