Invention Grant
- Patent Title: Power MOSFET with an integrated pseudo-Schottky diode in source contact trench
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Application No.: US16396473Application Date: 2019-04-26
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Publication No.: US10861965B2Publication Date: 2020-12-08
- Inventor: Shengling Deng
- Applicant: Renesas Electronics America Inc.
- Applicant Address: US CA Milpitas
- Assignee: Renesas Electronics America Inc.
- Current Assignee: Renesas Electronics America Inc.
- Current Assignee Address: US CA Milpitas
- Agency: Foley & Lardner LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L29/06 ; H01L29/423 ; H01L29/40 ; H01L29/66

Abstract:
The present embodiments provide a region of a semiconductor device comprising a plurality of power transistor cells configured as trench MOSFETs in a semiconductor substrate. At least one active power transistor cell further includes a trenched source region wherein a trench bottom surface of the trenched source contact is covered with an insulation layer and layer of a conductive material on top of the insulation layer, to function as an integrated pseudo Schottky barrier diode in the active power transistor cell.
Public/Granted literature
- US20200020798A1 POWER MOSFET WITH AN INTEGRATED PSEUDO-SCHOTTKY DIODE IN SOURCE CONTACT TRENCH Public/Granted day:2020-01-16
Information query
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