Invention Grant
- Patent Title: Semiconductor device with negative capacitance structure and method for forming the same
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Application No.: US16427078Application Date: 2019-05-30
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Publication No.: US10861968B1Publication Date: 2020-12-08
- Inventor: Bo-Feng Young , Chih-Yu Chang , Sai-Hooi Yeong , Chi-On Chui , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/417 ; H01L29/51 ; H01L29/24 ; H01L29/66 ; H01L29/40 ; H01L21/467

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a fin structure that includes a negative capacitance (NC) material. The semiconductor device structure also includes a gate electrode layer, a gate dielectric structure, a source feature, and a drain feature. The gate dielectric structure covers the top surface and the opposing sidewall surfaces of the fin structure. The gate electrode layer is formed over the gate dielectric structure. The source feature and the drain feature are formed in and protrude from the fin structure, and separated from each other by the gate electrode layer.
Public/Granted literature
- US20200381559A1 SEMICONDUCTOR DEVICE WITH NEGATIVE CAPACITANCE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2020-12-03
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