Invention Grant
- Patent Title: Image sensor with an absorption enhancement semiconductor layer
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Application No.: US16682278Application Date: 2019-11-13
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Publication No.: US10861989B2Publication Date: 2020-12-08
- Inventor: Ming-Chi Wu , Chien Nan Tu , Kun-Yu Lin , Shih-Shiung Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Eschweiler & Potaschnik, LLC
- Main IPC: H01L31/18
- IPC: H01L31/18 ; H01L31/0236 ; H01L31/028 ; H01L27/146 ; H01L31/109 ; H01L31/0232

Abstract:
An image sensor with an absorption enhancement semiconductor layer is provided. In some embodiments, the image sensor comprises a front-side semiconductor layer, an absorption enhancement semiconductor layer, and a back-side semiconductor layer that are stacked. The absorption enhancement semiconductor layer is stacked between the front-side and back-side semiconductor layers. The absorption enhancement semiconductor layer has an energy bandgap less than that of the front-side semiconductor layer. Further, the image sensor comprises a plurality of protrusions and a photodetector. The protrusions are defined by the back-side semiconductor layer, and the photodetector is defined by the front-side semiconductor layer, the absorption enhancement semiconductor layer, and the back-side semiconductor layer.
Public/Granted literature
- US20200083390A1 IMAGE SENSOR WITH AN ABSORPTION ENHANCEMENT SEMICONDUCTOR LAYER Public/Granted day:2020-03-12
Information query
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