Invention Grant
- Patent Title: Adhesive layer with varied material properties
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Application No.: US16457091Application Date: 2019-06-28
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Publication No.: US10862007B1Publication Date: 2020-12-08
- Inventor: Vernon Wong , Ken Shimizu , Daniel B. Roitman
- Applicant: Lumileds Holding B.V.
- Applicant Address: US CA San Jose
- Assignee: Lumileds LLC
- Current Assignee: Lumileds LLC
- Current Assignee Address: US CA San Jose
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: F21V3/00
- IPC: F21V3/00 ; F21V5/00 ; H01L33/50 ; F21S41/143 ; H01L33/58 ; H01L33/60 ; H01L33/64 ; C09J183/04 ; C09J9/00 ; C08G77/00

Abstract:
A light emitting package and method of making the package are described. The package contains an LED bonded to a light converting layer using an adhesive. The adhesive is jet printed, mask sprayed or extruded onto one of the surfaces before bonding. The adhesive has materials in different sections that differ in refractive index, oxygen permeability, and/or heat conductivity. The materials are formed in concentric rings around the adhesive center, islands or lines and are disposed to provide optical lensing or increasing permeability/heat conductivity with decreasing distance from the center. A substantially-reflective optical side coat surrounds the LED, adhesive layer and connecting structure.
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