Invention Grant
- Patent Title: Strong, heat stable junction
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Application No.: US16037835Application Date: 2018-07-17
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Publication No.: US10862016B2Publication Date: 2020-12-08
- Inventor: Patrick J Taylor , Sudhir Trivedi , Wendy L Sarney
- Applicant: U.S. Gov't, as represented by Sec of Army
- Applicant Address: US DC Washington
- Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee: The United States of America as represented by the Secretary of the Army
- Current Assignee Address: US DC Washington
- Agent Eric B. Compton
- Main IPC: H01L35/08
- IPC: H01L35/08 ; H01L35/34 ; H01L23/00

Abstract:
Provided among other things is an electrical device comprising: a first component that is a semiconductor or an electrical conductor; a second component that is an electrical conductor; and a strong, heat stable junction there between including an intermetallic bond formed of: substantially (a) tin (Sn) or a mixture of Sn and indium (In) thereof, and (b) substantially nickel (Ni). The junction can have an electrical contact resistance that is small compared to the resistance of the electrical device.
Public/Granted literature
- US20180342659A1 STRONG, HEAT STABLE JUNCTION Public/Granted day:2018-11-29
Information query
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