Invention Grant
- Patent Title: Method for manufacturing light-emitting device
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Application No.: US16438881Application Date: 2019-06-12
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Publication No.: US10862065B2Publication Date: 2020-12-08
- Inventor: Yoshiharu Hirakata , Shunpei Yamazaki
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Agency: Husch Blackwell LLP
- Priority: JP2012-178810 20120810
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/00 ; H01L51/56 ; H01L27/32 ; H04M1/02
Abstract:
To provide a method for manufacturing a lightweight light-emitting device having a light-emitting region on a curved surface. The light-emitting region is provided on a curved surface in such a manner that a light-emitting element is formed on a flexible substrate supported in a plate-like shape and the flexible substrate deforms or returns.
Public/Granted literature
- US20190296258A1 Method for Manufacturing Light-Emitting Device Public/Granted day:2019-09-26
Information query
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