Invention Grant
- Patent Title: Aluminum plate and method for manufacturing aluminum plate
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Application No.: US15483015Application Date: 2017-04-10
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Publication No.: US10862133B2Publication Date: 2020-12-08
- Inventor: Hiroshi Komatsu
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-210093 20141014
- Main IPC: H01M4/80
- IPC: H01M4/80 ; H01M4/70 ; H01M4/66 ; C25D11/04 ; C25D11/02 ; C25D9/12 ; C25F3/04 ; C25F3/14 ; C25D11/20 ; C23C18/34 ; C25D11/24 ; C25D11/08 ; C23C18/36 ; C23C18/16 ; C23C18/54 ; C25D3/38

Abstract:
An object is to provide an aluminum plate having favorable coating properties and favorable adhesiveness to active materials and a method for manufacturing an aluminum plate. The aluminum plate having a plurality of through holes that penetrate in a thickness direction includes through holes A which have an average opening diameter of the through holes of 0.1 μm or more and less than 100 μm and have a shape in which a maximum diameter Ra is formed inside and the maximum diameter Ra and a minimum diameter Rb satisfy 1>Rb/Ra≥0.1.
Public/Granted literature
- US20170214059A1 ALUMINUM PLATE AND METHOD FOR MANUFACTURING ALUMINUM PLATE Public/Granted day:2017-07-27
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