Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16227834Application Date: 2018-12-20
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Publication No.: US10862275B2Publication Date: 2020-12-08
- Inventor: Kazuo Fukagai
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2015-170334 20150831
- Main IPC: H01S5/343
- IPC: H01S5/343 ; H01S5/10 ; H01S5/223 ; H01S5/042 ; H01S5/028 ; H01S5/16 ; H01S5/22

Abstract:
A semiconductor device includes a first pair of nitride semiconductor regions, and a current confinement region which includes a first portion, a second portion disposed on a side of the first portion, and a third portion disposed on another side of the first portion. A width of the second portion is larger than a width of the first portion, the width of the second portion is larger than a width between the first pair of nitride semiconductor regions, and both ends of the second portion are covered by the first pair of nitride semiconductor regions, respectively.
Public/Granted literature
- US20190123515A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-04-25
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