Invention Grant
- Patent Title: Headphone set
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Application No.: US16575854Application Date: 2019-09-19
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Publication No.: US10863259B2Publication Date: 2020-12-08
- Inventor: Taku Ohno
- Applicant: YAMAHA CORPORATION
- Applicant Address: JP Hamamatsu
- Assignee: YAMAHA CORPORATION
- Current Assignee: YAMAHA CORPORATION
- Current Assignee Address: JP Hamamatsu
- Agency: Rossi, Kimms & McDowell LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R27/00 ; H04R29/00

Abstract:
A headphone set includes receivers, a signal processor that applies a given processing to each of audio signals received by respective ones of the receivers, a first adder that adds left signals together, to which the given processing is applied, a second adder that adds right signals together, to which the given processing is applied, a first sound output device that outputs a sound based on an output signal of the first adder, and a second sound output device that outputs a sound based on an output signal of the second adder.
Public/Granted literature
- US20200014997A1 HEADPHONE SET Public/Granted day:2020-01-09
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