Invention Grant
- Patent Title: Self-installing connections for rack liquid cooling
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Application No.: US16903799Application Date: 2020-06-17
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Publication No.: US10863652B1Publication Date: 2020-12-08
- Inventor: Ryan F. Conroy , Felipe Enrique Ortega Gutierrez , Luke Thomas Gregory
- Applicant: Amazon Technologies, Inc.
- Applicant Address: US WA Seattle
- Assignee: Amazon Technologies, Inc.
- Current Assignee: Amazon Technologies, Inc.
- Current Assignee Address: US WA Seattle
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F16L21/00 ; F16K25/00 ; F16L33/16 ; F16L17/025

Abstract:
A self-installing connector for a liquid cooling system of a datacenter component rack system. A datacenter component rack may include manifolds for conveying coolant to or from one or more datacenter electronic components for liquid cooling components of the datacenter electronic component. The self-installing connector provides a fluid connection between the manifold and a liquid cooling system of a datacenter electronic component. The self-installing connector may puncture the manifold at the time the datacenter electronic component is installed. The self-installing connector may form an opening in the manifold and secure one end of the self-installing connector into the opening upon installation of the datacenter electronic component into the datacenter component rack. The self-installing connector can separate at a dripless quick-disconnect coupling for datacenter electronic component maintenance.
Information query