- Patent Title: Modular mat system, mat modules and associated connection methods
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Application No.: US16460299Application Date: 2019-07-02
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Publication No.: US10881232B2Publication Date: 2021-01-05
- Inventor: Richard R. Bing , Patrick J. Chilenski , David S. Mesko
- Applicant: Cintas Corporate Services, Inc.
- Applicant Address: US OH Cincinnati
- Assignee: Cintas Corporate Services, Inc.
- Current Assignee: Cintas Corporate Services, Inc.
- Current Assignee Address: US OH Cincinnati
- Agency: Wood Herron & Evans LLP
- Main IPC: B32B3/06
- IPC: B32B3/06 ; A47G27/02 ; B32B3/30

Abstract:
A mat system is made up of multiple mat modules with interlocking features that allow for separate mat modules to be assembled into different patterns or shapes to cover larger areas as an area mat, define long pathways such as in hallways and customize the shape of the mat may be used to better fit the specific location. The mat modules are secured to each other to provide larger mat systems with a safer and better-looking transition. The mat modules are constructed such that there is a first connecting arrangement and a second connecting arrangement. When the mat modules are assembled, the first connecting arrangement on one mat module will assemble to the second connecting arrangement and an adjacent mat module to provide a secure and seamless connection between the mat modules. These connecting features can be integral to the mat modules or separate pieces.
Public/Granted literature
- US20200008600A1 MODULAR MAT SYSTEM, MAT MODULES AND ASSOCIATED CONNECTION METHODS Public/Granted day:2020-01-09
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