A method of weeding a design in a substrate have a first layer and a second layer is disclosed. The method determines an outline of the design and an inlet portion of the outline. The inlet portion is defined on at least a first and second side by the outline of the design and is open on at least a third side. The method cuts through the first layer but not the second layer along at least a portion of the outline that is not included in the inlet portion. The method also cuts through both the first and second layers along the inlet portion of the outline. The method also cuts through both the first and second layers along a path that closes the third side of the inlet portion.