Invention Grant
- Patent Title: Spindle device
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Application No.: US16525860Application Date: 2019-07-30
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Publication No.: US10882156B2Publication Date: 2021-01-05
- Inventor: Masahiro Murota
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Agency: Fredrikson & Byron, P.A.
- Priority: JP2018-143641 20180731
- Main IPC: F16C32/06
- IPC: F16C32/06 ; B23B19/02 ; B23Q11/12 ; B23Q11/08 ; B23Q11/14 ; B23Q1/70

Abstract:
In a spindle device, a cover member covers a surface of a flange portion on the front side of the spindle shaft, the flange portion projecting radially outward from the outer peripheral surface of the spindle housing, and the outer peripheral surface of the spindle housing extending from the surface of the flange portion toward the front of the spindle shaft. In the cover member, a flow path for allowing a coolant to flow therethrough is formed.
Public/Granted literature
- US20200039017A1 SPINDLE DEVICE Public/Granted day:2020-02-06
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