Invention Grant
- Patent Title: Polishing pad and polishing method
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Application No.: US15744460Application Date: 2016-05-18
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Publication No.: US10882157B2Publication Date: 2021-01-05
- Inventor: Hitoshi Morinaga , Kazusei Tamai , Muneaki Tahara , Maiko Asai , Yuuichi Ito
- Applicant: FUJIMI INCORPORATED
- Applicant Address: JP Kiyosu
- Assignee: FUJIMI INCORPORATED
- Current Assignee: FUJIMI INCORPORATED
- Current Assignee Address: JP Kiyosu
- Agency: Foley & Lardner LLP
- Priority: JP2015-143464 20150717,JP2016-064312 20160328
- International Application: PCT/JP2016/064775 WO 20160518
- International Announcement: WO2017/013935 WO 20170126
- Main IPC: B24B29/02
- IPC: B24B29/02 ; B24B37/26 ; B24B37/24 ; B24B37/22 ; B32B5/12 ; B32B5/24 ; B32B27/36

Abstract:
To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.
Public/Granted literature
- US20180200861A1 POLISHING PAD AND POLISHING METHOD Public/Granted day:2018-07-19
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