Invention Grant
- Patent Title: Peeling method of flexible substrate
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Application No.: US15574068Application Date: 2017-04-10
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Publication No.: US10882221B2Publication Date: 2021-01-05
- Inventor: Ming Che Hsieh , Chunyan Xie , Lu Liu , Hejin Wang , Yuanzheng Guo
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Westman, Champlin & Koehler, P.A.
- Priority: CN201610244839 20160418
- International Application: PCT/CN2017/079893 WO 20170410
- International Announcement: WO2017/181860 WO 20171026
- Main IPC: B29C35/08
- IPC: B29C35/08 ; B32B7/12 ; H01L21/683 ; B29C41/02 ; B29L31/34

Abstract:
This disclosure relates to a peeling method of a flexible substrate, and belongs to the technical field of flexible display. The method comprises the steps of: (a) forming a flexible substrate on a base substrate, wherein the flexible substrate has a plane area less than that of the base substrate; (b) adhering a protective film on the base substrate formed with the flexible substrate by an ultraviolet viscosity-reducing adhesive, wherein the plane area of the flexible substrate is less than that of the protective film, and the protective film is further adhered to the base substrate by the ultraviolet viscosity-reducing adhesive; (c) irradiating a region on the base substrate covered by the protective film through the base substrate with an ultraviolet light; and (d) peeling the protective film and the flexible substrate from the base substrate after the irradiation with an ultraviolet light is completed.
Public/Granted literature
- US20180290344A1 PEELING METHOD OF FLEXIBLE SUBSTRATE Public/Granted day:2018-10-11
Information query
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