Invention Grant
- Patent Title: Heat bonding of low energy surface substrates
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Application No.: US15740202Application Date: 2016-07-06
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Publication No.: US10882292B2Publication Date: 2021-01-05
- Inventor: Kenneth A. Mazich , Jeffrey R. Apfel , Kenneth S. Makuch
- Applicant: Zephyros, Inc.
- Applicant Address: US MI Romeo
- Assignee: Zephyros, Inc.
- Current Assignee: Zephyros, Inc.
- Current Assignee Address: US MI Romeo
- Agency: The Dobrusin Law Firm, P.C.
- International Application: PCT/US2016/041143 WO 20160706
- International Announcement: WO2017/007823 WO 20170112
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B32B37/12 ; B32B27/32 ; B32B5/02 ; B32B5/20 ; B32B7/12 ; B32B27/06 ; B32B27/08 ; B32B27/12 ; B32B27/38 ; B32B27/26 ; B32B5/24 ; C09J5/06 ; B32B27/16 ; B32B37/14 ; C09J1/00 ; B32B38/00 ; B29C65/04 ; B29C65/32 ; B29C65/46 ; B29C65/48 ; B29C65/14

Abstract:
A method comprising providing a polymeric substrate having a melting point of from about 130° C. to about 190° C., and locating a material layer onto the substrate, wherein the material layer comprises one or more polymeric materials that liquefy upon exposure to temperatures of at least about 100° C., to blend with a softened portion of the polymeric substrate. Upon exposure of one or more of the substrate and the material layer to a stimulus, the temperature is increased in a predetermined temperature zone of one or more of the substrate and material layer to cause blending of the one or more polymeric materials of the material layer with the softened portion of the polymeric substrate.
Public/Granted literature
- US20180186141A1 HEAT BONDING OF LOW ENERGY SURFACE SUBSTRATES Public/Granted day:2018-07-05
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