Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
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Application No.: US16446751Application Date: 2019-06-20
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Publication No.: US10882316B2Publication Date: 2021-01-05
- Inventor: Yoichi Naganuma
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2018-117507 20180621
- Main IPC: B41J2/14
- IPC: B41J2/14

Abstract:
A liquid ejecting head includes a nozzle plate, a multilayer substrate, and a pressure chamber substrate. The multilayer substrate includes a liquid chamber wall portion. The liquid chamber wall portion has a first wall surface facing a common liquid chamber. The multilayer substrate has a supply flow path which has an inlet portion coupled to the first wall surface and via which the common liquid chamber communicates with the first pressure chamber. When a direction from the common liquid chamber toward the first pressure chamber is defined as a first direction, and a direction intersecting the first direction is defined as a second direction, the supply flow path includes a first portion having a first width in the inlet portion and a second portion having a second width, in a first cross section along the first direction and the second direction. The first width is narrower than the second width.
Public/Granted literature
- US20190389217A1 Liquid Ejecting Head And Liquid Ejecting Apparatus Public/Granted day:2019-12-26
Information query
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