Invention Grant
- Patent Title: Vanadium compound
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Application No.: US16308900Application Date: 2017-05-15
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Publication No.: US10882874B2Publication Date: 2021-01-05
- Inventor: Makoto Okabe , Akihiro Nishida , Tomoharu Yoshino
- Applicant: ADEKA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADEKA CORPORATION
- Current Assignee: ADEKA CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2016-123398 20160622
- International Application: PCT/JP2017/018235 WO 20170515
- International Announcement: WO2017/221586 WO 20171228
- Main IPC: C07F9/00
- IPC: C07F9/00 ; C23C16/18 ; H01L21/285 ; C07C251/08 ; C23C16/34 ; C23C16/455

Abstract:
A vanadium compound represented by following General Formula (1). In General Formula (1), R1 represents a linear or branched alkyl group having 1 to 7 carbon atoms and n represents a number from 2 to 4. R1 preferably represents a secondary alkyl or a tertiary alkyl. It is preferred that in General Formula (1), n is 2 and R1 is tert-butyl group or tert-pentyl group, since the compound has a broad ALD window and high thermal decomposition temperature to be able to form a good quality vanadium-containing thin film that has a small carbon residue when used as an ALD material.
Public/Granted literature
- US20190177346A1 VANADIUM COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, AND METHOD FOR MANUFACTURING THIN FILM Public/Granted day:2019-06-13
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