Invention Grant
- Patent Title: Dynamically impacting method for simultaneously peening and film-forming on substrate as bombarded by metallic glass particles
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Application No.: US16111176Application Date: 2018-08-23
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Publication No.: US10883152B2Publication Date: 2021-01-05
- Inventor: Kuan-Wei Chen , Jason Shian-Ching Jang , Po-Jen Wei
- Applicant: Kuan-Wei Chen , Jason Shian-Ching Jang , Po-Jen Wei
- Applicant Address: TW Tainan; TW Tainan; TW Tainan
- Assignee: Kuan-Wei Chen,Jason Shian-Ching Jang,Po-Jen Wei
- Current Assignee: Kuan-Wei Chen,Jason Shian-Ching Jang,Po-Jen Wei
- Current Assignee Address: TW Tainan; TW Tainan; TW Tainan
- Main IPC: C21D7/06
- IPC: C21D7/06 ; B22F9/00 ; B22F9/08 ; B24C1/10
Abstract:
A dynamically impacting method comprising simultaneously peening a substrate surface and forming a thin film of metallic glass on the substrate surface for increasing the surface hardness, fatigue resistance, anti-fracture toughness and corrosion resistance of the substrate simultaneously.
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