Invention Grant
- Patent Title: Copper electrodeposition solution and process for high aspect ratio patterns
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Application No.: US15745836Application Date: 2017-12-26
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Publication No.: US10883185B2Publication Date: 2021-01-05
- Inventor: Laurianne Religieux , Vincent Mevellec , Mikailou Thiam
- Applicant: aveni
- Applicant Address: FR Massy
- Assignee: aveni
- Current Assignee: aveni
- Current Assignee Address: FR Massy
- Agency: Hamre. Schumann, Mueller & Larson, P.C.
- Priority: FR1663525 20161229
- International Application: PCT/EP2017/084580 WO 20171226
- International Announcement: WO2018/122216 WO 20180705
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D7/12 ; H01L21/768
Abstract:
The present invention relates to an electrolyte composition for depositing copper on a conductive surface. The composition contains a combination of 2,2′-bipyridine, imidazole, tetra-ethyl-ammonium, and a complexing agent for copper. This electrolyte makes it possible to manufacture small size copper interconnects without any void and with a filling speed that is compatible with industrial constrain.
The invention also concerns a process for filling cavities with copper, and a semiconductor device that is obtained according to this process.
The invention also concerns a process for filling cavities with copper, and a semiconductor device that is obtained according to this process.
Public/Granted literature
- US20180363158A1 COPPER ELECTRODEPOSITION SOLUTION AND PROCESS FOR HIGH ASPECT RATIO PATTERNS Public/Granted day:2018-12-20
Information query
