Invention Grant
- Patent Title: Hinge module and electronic device
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Application No.: US16378566Application Date: 2019-04-09
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Publication No.: US10884461B2Publication Date: 2021-01-05
- Inventor: Che-Hsien Lin , Che-Hsien Chu , Chun-An Shen
- Applicant: Che-Hsien Lin , Che-Hsien Chu , Chun-An Shen
- Applicant Address: TW Taipei; TW Taipei; TW Taipei
- Assignee: Che-Hsien Lin,Che-Hsien Chu,Chun-An Shen
- Current Assignee: Che-Hsien Lin,Che-Hsien Chu,Chun-An Shen
- Current Assignee Address: TW Taipei; TW Taipei; TW Taipei
- Agency: JCIPRNET
- Main IPC: G06F1/16
- IPC: G06F1/16 ; F16C11/04 ; E05D11/06 ; E05D11/08 ; E05D3/12

Abstract:
A hinge module includes a housing and at least one carrying assembly. The housing includes two accommodation spaces. The at least one carrying assembly is disposed at the housing and includes a torque element, two rotation shafts and two brackets. The torque element is disposed in one of the accommodation spaces. The two rotation shafts pass through the torque element. The two brackets are respectively connected to the two rotation shafts and located outside the housing. Each bracket is adapted to rotate along with the corresponding rotation shaft and rotate relative to the torque element.
Public/Granted literature
- US20190317560A1 HINGE MODULE AND ELECTRONIC DEVICE Public/Granted day:2019-10-17
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