Substrates suitable for optoelectronic display devices are prepared by: (a) applying a liquid silicone optical bonding agent to a first substrate, (b) activating the liquid silicone optical bonding agent applied in step (a) by irradiation with light in a wavelength range of 200 nm to 500 nm, wherein the duration of the irradiation is less than the gel time of the liquid silicone optical bonding agent, and (c) applying a second substrate to the activated liquid silicone optical bonding agent before the liquid silicone optical bonding agent is gelled.