The present disclosure generally relates to data storage devices comprising one or more memory packages. At least one memory package of the storage device comprises a first stack of memory dies coupled together by a first chip select line and a second stack of memory dies coupled together by a second chip select line. Both the first stack and the second stack comprise a plurality of non-volatile memory dies and a dissimilar memory die disposed on top of the plurality of non-volatile memory dies. Within both the first stack and the second stack, the plurality of non-volatile memory dies is a different type of memory than the dissimilar memory die. Additionally, within both the first stack and the second stack, the plurality of non-volatile memory dies is configured to store host data, and the dissimilar memory die is configured to store cached data.