Invention Grant
- Patent Title: System and method for determining dimensional range of repairable defects by deposition and etching in a virtual fabrication environment
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Application No.: US16662778Application Date: 2019-10-24
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Publication No.: US10885253B2Publication Date: 2021-01-05
- Inventor: Daniel Sobieski , Rich Wise , Yang Pan , David M. Fried , Jiangjiang Gu
- Applicant: Coventor, Inc.
- Applicant Address: US NC Cary
- Assignee: Coventor, Inc.
- Current Assignee: Coventor, Inc.
- Current Assignee Address: US NC Cary
- Agency: McCarter & English, LLP
- Agent John S. Curran
- Main IPC: G06F30/367
- IPC: G06F30/367 ; G06T17/10 ; G03F7/004 ; G03F7/00 ; G03F7/20 ; G06F30/20 ; G06F119/18
Abstract:
A virtual fabrication environment for semiconductor device fabrication that determines a lowest lithography exposure dose range in which one or more defects are still reparable by deposition and etch operations is discussed. Further techniques for repairing line edge roughness caused by lithography are described.
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